FA & Reliability Engineer, Advanced Packaging, Early in Career - (E3)

Company: Applied Materials
Location: Augusta
Posted on: March 15, 2023

Job Description:

Position Description : Failure Analysis & Reliability Engineer Emphasis on substrate failure mode identification and root cause and reliability for design of advanced substrates used in semiconductor packaging
Summary:

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  Packaging failure analysis. Hands-on experience to identify failure mode with cross sectioning and imaging techniques ranging from um to nm scale. Strong understanding of reliability failure modes and how to solve them.
  
  
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  Travel to Georgia and Korea will be required in this role
  
  
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  Required to relocate to Georgia by Jan 1, 2024
  
  
  Responsibilities:
  
  
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  Focus on glass processing in small or high-volume manufacturing (S/HVM) and drive processes to fill any gaps in the transition from R&D to S/HVM for glass substrates
  
  
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  Develop a good understanding of known failure modes and create experiments that can be used to test to fail, to show new failure modes. Draw boundary conditions that can be used to decide safe operation zones for the product
  
  
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  Work with the Technology team to suggest corrective actions that could potentially increase the process window for the process of record method used for panel manufacturing
  
  
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  Develop prototypes to prove failure conditions of the R&D flow and to link that with the impending changes being made in the S/HVM factories. The S/HVM unit processes may/will be using different equipment than in R&D and the responsibility to understand the impact of those changes on product reliability is an important output of this role
  
  
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  Create accelerated testing methods while being aware of the need to avoid false negative or false positive results as much as possible. Create tests to ensure package resiliency to meet the specification signed up to for customers
  
  
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  Complete root-cause analysis of all failure modes and create Pareto's to identify the weakest links in the process flow so that the Technology and Manufacturing teams can create task forces as needed to address those. Characterizing the source of the failure into materials, chemistry, stress states, temperature and environmental exposure etc.
  
  
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  Have a good understanding of the unit process equipment and the available process window that will deliver the desired performance for every unit process
  
  
  Education: M.S. or Ph.D. in an Engineering discipline
  Experience: 3-5 years in the semiconductor industry
  #LI
  Qualifications
  Education:
  Bachelor's Degree
  Skills
  Certifications:
  Languages:
  Years of Experience:
  4 - 7 Years
  Work Experience:
  Additional Information
  Travel:
  Yes, 50% of the Time
  Relocation Eligible:
  No
  U.S. Salary Range:
  $100,000.00 - $137,500.00
  The salary offered to a selected candidate will be based on a number of factors including location and level and will vary depending on confirmed job-related knowledge, skills, and experience. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
  Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
  Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible a Better Future.

Keywords: Applied Materials, Augusta , FA & Reliability Engineer, Advanced Packaging, Early in Career - (E3), Engineering , Augusta, Georgia